Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

Licari, James J.
Swanson, Dale W.

Paperback

Series: Materials and Processes for Electronic Applications

Technology & Engineering

ISBN10: 0128103701
ISBN13: 9780128103708
Publisher: William Andrew
Published: Aug 19 2016
Pages: 512
Weight: 1.21
Height: 0.85 Width: 6.00 Depth: 9.00
Language: English

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.

The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.

The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date.

As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as:

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