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Arbitrary Modeling of Tsvs for 3D Integrated Circuits

Arbitrary Modeling of Tsvs for 3D Integrated Circuits

Hardcover

Series: Analog Circuits and Signal Processing

Technology & EngineeringGeneral Computers

ISBN10: 3319076108
ISBN13: 9783319076102
Publisher: Springer Nature
Published: Sep 5 2014
Pages: 179
Weight: 0.99
Height: 0.50 Width: 6.14 Depth: 9.21
Language: English
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

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