Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
612-822-4611

  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Analog-Baseband Architectures and Circuits for Multistandard and Low-Voltage Wireless Transceivers

Analog-Baseband Architectures and Circuits for Multistandard and Low-Voltage Wireless Transceivers

Mak, Pui-In
U. Seng Pan, Ben
Martins, Rui Paulo

Hardcover

Series: Analog Circuits and Signal Processing

Technology & Engineering

ISBN10: 1402064322
ISBN13: 9781402064326
Publisher: Springer Nature
Published: Sep 20 2007
Pages: 178
Weight: 1.02
Height: 0.50 Width: 6.14 Depth: 9.21
Language: English
The prospect of initializing a network-ubiquitous society in the years to come has led to the development of multistandard-compliant wireless transceivers for seamless roaming among multiple networks. To ensure a commercial success of such a development, the manufacturing cost and power consumption of the system chips have to be minimized. The use of an advanced technology and a high level of integration have continued to be the most effective ways for cost and power minimization, given that wireless chips integrate large amounts of digital logic for computation. Regrettably, entering into the nanoelectronics era, the thinner transistor gate oxide implicates great challenges in the design of the analog front-ends. While a low-voltage supply is imposed to maintain device reliability, a relatively large threshold voltage is also necessitated to limit the leakage current. Thus, transceiver architectures and circuits which will befit future full integration of multistandard wireless transceivers in sub-1V nanoscale CMOS processes must be highly reconfigurable and robustly operational underneath a l- voltage supply. This book presents novel analog-baseband architectures and circuits that help realizing multistandard and low-voltage wireless transceivers. The main contents are presented from Chapter 2 to Chapter 6, as pictorially outlined in Figure 1. Chapter 1 overviews the current wireless-IC developments and presents the motivation and research objectives of this book. xi xii Preface Figure 1.

Also in

Technology & Engineering

View All