Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Advanced Packaging for Microelectronic and Microsystem Applications

Advanced Packaging for Microelectronic and Microsystem Applications

Anderson, Travis

Paperback

Technology & Engineering

ISBN10: 3639096762
ISBN13: 9783639096767
Publisher: Blues Kids Of Amer
Published: Nov 26 2008
Pages: 116
Weight: 0.36
Height: 0.24 Width: 6.00 Depth: 9.00
Language: English
The emergence of GaN-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility power switching. The properties of this system make it ideally suited for operation at elevated temperatures and at voltage and current levels well beyond that accessible by Si. Recent improvements in material quality and device performance are rapidly opening the door to commercialization, and III-N technologies are demonstrating exciting developments of late. Though devices are entering commercialization, there are still considerable un-knowns, particularly in the reliability field. Recent advances at the University of Florida will be detailed in this work.

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