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612-822-4611
Advanced Interconnect and Packaging

Advanced Interconnect and Packaging

Hardcover

Technology & Engineering

ISBN10: 303656733X
ISBN13: 9783036567334
Publisher: Mdpi Ag
Published: Feb 20 2023
Pages: 266
Weight: 1.70
Height: 0.88 Width: 6.69 Depth: 9.61
Language: English

Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated circuits. To resolve these interconnect problems, various emerging technologies, including airgap, nanocarbon, optical, and through-silicon via (TSV), have been proposed and investigated. For example, by virtue of TSV technology, dies can be stacked to increase the integration density. More importantly, 3D integration and packaging also offer the most promising platform to implement More-than-Moore technologies, providing heterogeneous materials and technologies on a single chip.

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Technology & Engineering