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612-822-4611
3D Integration for VLSI Systems

3D Integration for VLSI Systems

Hardcover

Technology & EngineeringPhysics

ISBN10: 981430381X
ISBN13: 9789814303811
Publisher: Jenny Stanford Pub
Published: Sep 26 2011
Pages: 378
Weight: 1.48
Height: 0.88 Width: 6.00 Depth: 9.00
Language: English

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.

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