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Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
3D IC and 2.5d IC Design: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal Management, and Design Optimization

3D IC and 2.5d IC Design: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal Management, and Design Optimization

Paperback

Series: VLSI Design & Semiconductor Engineering

Technology & Engineering

Currently unavailable to order

ISBN13: 9798172479724
Publisher: Independently Published
Pages: 256
Weight: 0.76
Height: 0.54 Width: 6.00 Depth: 9.00
Language: English

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Technology & Engineering