Sign-In
Cart
3D IC and 2.5d IC Design: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal Management, and Design Optimization
Paperback
Series: VLSI Design & Semiconductor Engineering
Please select the version of book you would like to purchase.
ISBN13: 9798172479724
Publisher: Independently Published
Published: Sep 7 2026
Pages: 256
Weight: 0.76
Height: 0.54 Width: 6.00 Depth: 9.00
Language: English
Publisher: Independently Published
Published: Sep 7 2026
Pages: 256
Weight: 0.76
Height: 0.54 Width: 6.00 Depth: 9.00
Language: English
The idea for this book grew out of a simple observation: while through-silicon vias, silicon interposers, and chiplet-based design have moved from research curiosities to the technologies underpinning nearly every leading-edge AI accelerator, server processor, and premium mobile system-on-chip shipped today, no single text had brought together the full breadth of this subject - from the physics of via etching to the economics of chiplet partitioning to the standards governing die-to-die interfaces - in one coherent, classroom- and practice-ready volume. This book is my attempt to fill that gap.
3D and 2.5D integration sit at an unusually rich intersection of disciplines. A practicing engineer in this field must be conversant with semiconductor process technology (to understand what a foundry or OSAT partner can actually manufacture), with circuit and physical design (to build a chiplet that will function correctly once assembled), with thermal and mechanical engineering (because heat and stress, not merely electrical signals, ultimately determine whether a stacked assembly survives its intended product lifetime), and increasingly with system architecture and even supply-chain economics (because the decision to partition a system into chiplets is as much a business decision as a technical one). I have tried, throughout this book, to give each of these dimensions its due, rather than treating 3D/2.5D integration as a narrowly circuit-level or narrowly process-level topic.
The book is organized to be read either sequentially, as a complete course of study, or selectively, by readers seeking depth in a particular subtopic. Part I establishes motivation and foundational packaging concepts. Part II works through the core enabling interconnect technologies - TSVs, interposers, redistribution layers, bonding, and stacking architectures - in the order a design team would typically encounter them when planning a new 3D/2.5D product. Part III addresses chiplet-based system design and the commercial packaging platforms that realize it in production. Part IV, the longest section of the book, treats the cross-cutting engineering disciplines - power delivery, signal integrity, thermal management, test, EDA methodology, design optimization, and reliability - that determine whether a 3D/2.5D system actually works, not merely in simulation but in high-volume manufacturing and in the field. Part V closes with applications and a look toward emerging research directions.
This book is intended for graduate students and advanced undergraduates in electrical engineering, computer engineering, and materials science; for practicing engineers moving into advanced packaging, physical design, or system architecture roles who need a structured introduction to this field; and for technical managers and program leads who need enough fluency across the full breadth of the subject to make informed partitioning, packaging, and technology-selection decisions. Each chapter is written to be self-contained enough to serve as a standalone reference, while cross-references throughout connect related material across chapters for readers working through the book sequentially.
The field this book describes is evolving rapidly, and any snapshot of specific commercial platforms, standard revisions, or process capabilities will inevitably age faster than the underlying physical principles and design disciplines that govern them. I have tried, wherever possible, to emphasize those durable principles - the physics of TSV parasitics, the economics of yield-driven partitioning, the systems-level logic of thermal-electrical-power co-design - over specific numbers that will shift with the next process generation, while still grounding the discussion in concrete, representative figures that give the reader a genuine feel for the scales involved.
The book is organized to be read either sequentially, as a complete course of study, or selectively, by readers seeking depth in a particular subtopic. Part I establishes motivation and foundational packaging concepts. Part II works through the core enabling interconnect technologies - TSVs, interposers, redistribution layers, bonding, and stacking architectures - in the order a design team would typically encounter them when planning a new 3D/2.5D product. Part III addresses chiplet-based system design and the commercial packaging platforms that realize it in production. Part IV, the longest section of the book, treats the cross-cutting engineering disciplines - power delivery, signal integrity, thermal management, test, EDA methodology, design optimization, and reliability - that determine whether a 3D/2.5D system actually works, not merely in simulation but in high-volume manufacturing and in the field. Part V closes with applications and a look toward emerging research directions.
This book is intended for graduate students and advanced undergraduates in electrical engineering, computer engineering, and materials science; for practicing engineers moving into advanced packaging, physical design, or system architecture roles who need a structured introduction to this field; and for technical managers and program leads who need enough fluency across the full breadth of the subject to make informed partitioning, packaging, and technology-selection decisions. Each chapter is written to be self-contained enough to serve as a standalone reference, while cross-references throughout connect related material across chapters for readers working through the book sequentially.
The field this book describes is evolving rapidly, and any snapshot of specific commercial platforms, standard revisions, or process capabilities will inevitably age faster than the underlying physical principles and design disciplines that govern them. I have tried, wherever possible, to emphasize those durable principles - the physics of TSV parasitics, the economics of yield-driven partitioning, the systems-level logic of thermal-electrical-power co-design - over specific numbers that will shift with the next process generation, while still grounding the discussion in concrete, representative figures that give the reader a genuine feel for the scales involved.
Also from
Srivastava, Saumya
Industrial Automation and Control Systems: PLC, SCADA, Sensors, Industrial Networks, Motion Control, and Intelligent Automation
Srivastava, Saumya
Paperback
$19.20
Fundamentals of Electronics Engineering: A Comprehensive Guide to Semiconductor Devices, Circuits, and Systems
Srivastava, Saumya
Paperback
$21.60
Modern Digital VLSI Design: RTL Design, Verification, Physical Design, AI-Driven EDA, and SoC Development for Industry Professionals
Srivastava, Saumya
Paperback
$25.20
Cloud-Native Software Development: Microservices, Containers, Kubernetes, Serverless, and Scalable Cloud Applications
Srivastava, Saumya
Paperback
$19.20
Genotypic Variation in Plants for Micronutrient Stress
Srivastava, Saumya
Arya, Prahlad Kumar
Paperback
$82.50
Genotypische Variation Bei Pflanzen Für Mikronährstoff-Stress
Srivastava, Saumya
Arya, Prahlad Kumar
Paperback
$82.50
Variation Génotypique Des Plantes Face Au Stress Des Micronutriments
Arya, Prahlad Kumar
Srivastava, Saumya
Paperback
$82.50
Variazione Genotipica Nelle Piante Per Lo Stress Da Micronutrienti
Srivastava, Saumya
Arya, Prahlad Kumar
Paperback
$82.50
Variação Genotípica Em Plantas Para O Stress de Micronutrientes
Arya, Prahlad Kumar
Srivastava, Saumya
Paperback
$82.50
Embedded Systems and PLC: Principles, Architecture, and Industrial Automation - From Microcontrollers to Programmable Logic Controllers
Srivastava, Saumya
Paperback
$19.20
AI and Industry 4.0 in Mechatronics: Intelligent Systems, Cyber-Physical Architectures, and the Future of Smart Manufacturing
Srivastava, Saumya
Paperback
$19.20
Edge AI and Intelligent Computing: Machine Learning, Embedded Systems, Edge Devices, and Real-Time AI Applications
Srivastava, Saumya
Paperback
$19.20
2D Materials for Nanoelectronics: Graphene, MoS₂, Transition Metal Dichalcogenides, Device Fabrication, and Emerging Applications
Srivastava, Saumya
Paperback
$19.20
VLSI Design Verification: Functional Verification, Simulation, Assertions, Coverage, Debugging, and Verification Methodologies
Srivastava, Saumya
Paperback
$19.20
Also in
Technology & Engineering
All Data Are Local: Thinking Critically in a Data-Driven Society
Loukissas, Yanni Alexander
Paperback
$45.00
The Age of Living Machines: How Biology Will Build the Next Technology Revolution
Hockfield, Susan
Paperback
$17.05
Ingenious Patents: Bubble Wrap, Barbed Wire, Bionic Eyes, and Other Pioneering Inventions
Bennett, Jay
Ikenson, Ben
Hardcover
$14.99
The Reverse Centaur's Guide to Life After AI: How to Think about Artificial Intelligence--Before It's Too Late
Doctorow, Cory
Paperback
$16.20
The Agi Chronicles: The Inside Story of the Race to Create an Artificial Superintelligence
Roose, Kevin
Hardcover
$29.70
Improvised Munitions Black Book: Complete and Unabridged in One Volume: Complete and Unabridged in One Volume
U S Government
Paperback
$18.99
You Don't Need a Smartphone: A Practical Guide to Downgrading Your Phone and Upgrading Your Life
Lamm, August
Paperback
$18.90
AI for Good: How Real People Are Using Artificial Intelligence to Fix Things That Matter
Tyrangiel, Josh
Hardcover
$27.55
The Story of Your Life: How Social Media Shapes the Way We Experience Everything
Jezer-Morton, Kathryn
Hardcover
$27.00
The Infinity Machine: Demis Hassabis, Deepmind, and the Quest for Superintelligence
Mallaby, Sebastian
Hardcover
$28.80
Ultimate Guide: Wiring, Updated 10th Edition: Meets Current National Electrical Code Standards
The Editors of Creative Homeowner
Paperback
$23.74
Basic Butchering of Livestock & Game: Beef, Veal, Pork, Lamb, Poultry, Rabbit, Venison
Mettler, John J.
Paperback
$17.09
Lightning Beneath the Sea: The Race to Wire the World and the Dawn of the Information Age
Tabor, James M.
Hardcover
$28.79
Like, Follow, Subscribe: Influencer Kids and the Cost of a Childhood Online
Latifi, Fortesa
Hardcover
$28.50
Kobuk the Destroyer: And Other Tales from the Wild, Unseen World of Test Engineering
Davies, Alex
Hardcover
$28.49
Empire of Ink: The Printers, Rogues, and Radicals Who Invented the American Newspaper
Wright, Alex
Hardcover
$30.60
Midnight in Chernobyl: The Untold Story of the World's Greatest Nuclear Disaster
Higginbotham, Adam
Paperback
$20.89
No One's Coming: The Rogue Heroes Our Government Turns to When There's Nowhere Else to Turn
Hazzard, Kevin
Hardcover
$28.50
The Home Blacksmith: Tools, Techniques, and 40 Practical Projects for the Home Blacksmith
Ridgway, Ryan
Paperback
$18.99
The Ultimate Guide to Rebuilding a Civilization: A Technical Manual for the Post-Collapse Era
Evans, James
Paperback
$19.99
City on the Edge: Technology, Politics, and the Fight for the Soul of San Francisco
Weber, Jonathan
Hardcover
$30.40
Curved Air: A Biography of Sickle Cell Anemia and the Quest to Cure the First Molecular Disease
Davies, Kevin
Hardcover
$26.96
The Elements of Power: A Story of War, Technology, and the Dirtiest Supply Chain on Earth
Niarchos, Nicolas
Hardcover
$28.80
Atlas of AI: Power, Politics, and the Planetary Costs of Artificial Intelligence
Crawford, Kate
Paperback
$19.00
The Problem with Plastic: How We Can Save Ourselves and Our Planet Before It's Too Late
Beyond Plastics
Enck, Judith
Mahoney, Adam
Hardcover
From $17.99
AI Snake Oil: What Artificial Intelligence Can Do, What It Can't, and How to Tell the Difference
Narayanan, Arvind
Kapoor, Sayash
Paperback
$16.10
Generation Regeneration: Codesigning the Future of Cities Through Regenerative Placemaking
Cho, Tony
Hardcover
$27.50
CompTIA Tech+ Certification All-in-One Exam Guide, Third Edition (Exam FC0-U71)
Wempen, Faithe
Paperback
$57.00
Crisis Engineering: Time-Tested Tools for Turning Chaos Into Clarity
Dickerson, Mikey
Nitze, Marina
Weaver, Matthew
Paperback
$18.99
A Brief History of Cities in 32 Inventions: The Ideas and Technologies That Made Modernity Possible
Elledge, Jonn
Hardcover
$22.46
The Boy Who Harnessed the Wind: Creating Currents of Electricity and Hope
Kamkwamba, William
Mealer, Bryan
Paperback
$18.04
Bringing Columbia Home: The Untold Story of a Lost Space Shuttle and Her Crew
Leinbach, Michael D.
Ward, Jonathan H.
Paperback
$18.04
Artificial Intelligence: A Guide for Thinking Humans (with a New Preface)
Mitchell, Melanie
Paperback
$19.00
Human + Machine, Updated and Expanded: Reimagining Work in the Age of AI
Wilson, H. James
Daugherty, Paul R.
Hardcover
$30.40
The Bitter Struggle: Superintelligence, Superpowers, and the Fate of the World
Buchanan, Ben
Collins, Tantum
Hardcover
$31.35
Cadillac Desert: The American West and Its Disappearing Water, Revised Edition
Reisner, Marc
Paperback
From $12.99
Meat: How the Next Agricultural Revolution Will Transform Humanity's Favorite Food--And Our Future
Friedrich, Bruce
Hardcover
$28.45
Make: Electronics: Learning by Discovery: A Hands-On Primer for the New Electronics Enthusiast
Platt, Charles
Paperback
$33.24
Pilot's Handbook of Aeronautical Knowledge: Faa-H-8083-25c
Federal Aviation Administration (FAA)
Hardcover
$47.49
The New Age of Sexism: How AI and Emerging Technologies Are Reinventing Misogyny
Bates, Laura
Hardcover
$27.54
Inconspicuous Consumption: The Environmental Impact You Don't Know You Have
Schlossberg, Tatiana
Paperback
$18.99
The Bullwhip's Algorithm: Artificial Intelligence and America's Racial Caste System
Bobb, Kamau
Hardcover
$26.55
CNC Woodworking for the Absolute Beginner: Winning Tips, Techniques & 5 Skill-Building Projects
Bagnall, Ralph
Paperback
$12.34
Bioinspired: How Nature Made Us Modern, Drives Today's Technological Innovation, and Inspires a Future Worth Inventing
Stier, Samuel Cord
Hardcover
$33.25
Tubes: A Journey to the Center of the Internet with a New Introduction by the Author
Blum, Andrew
Paperback
$18.99
AI Projects with Raspberry Pi: High-Performance Artificial Intelligence for Robotics, Security, Home Automation, and Vision
Hattersley, Lucy
Jepson, Brian
Paperback
$21.84
High-Wing Aircraft Visualized Flight Maneuvers Manual: For Pilots in Training
ASA Test Prep Board
Paperback
$23.70
ASE Technician Test Preparation Automotive Maintenance and Light Repair (G1)
Delmar Cengage Learning
Paperback
$56.48
The Baofeng Radio Revolution: The Beginner Guerrilla's Guide to Break Through the Complexity, Secure Communications, and Prepare for Disaster With Pre
Code Publishing, Morse
Hardcover
$28.49
Broken Money: Why Our Financial System is Failing Us and How We Can Make it Better
Alden, Lyn
Paperback
$22.79
The Trillion Dollar War Machine: How Runaway Military Spending Drives America Into Foreign Wars and Bankrupts Us at Home
Hartung, William D.
Freeman, Ben
Hardcover
$27.00
Disneyland and the Rise of Automation: How Technology Created the Happiest Place on Earth
Betancourt, Roland
Hardcover
$33.25
Agentic Artificial Intelligence: Harnessing AI Agents to Reinvent Business, Work, and Life
Bornet
Wirtz, Jochen
Davenport, Thomas H.
Paperback
$27.54
How to Use an Oscilloscope 2026: Master Measurement Skills for Electronics Beginners and Pros
Grant, Nathaniel Cole
Paperback
$13.19
Air Force Handbook 10-644 Survival Evasion Resistance Escape SERE Operations: 27 March 2017
The Air Force, Department of
Paperback
$31.49
The Coming Wave: Technology, Power, and the Twenty-First Century's Greatest Dilemma
Suleyman, Mustafa
Hardcover
$30.88
Drawing Lessons with Da Vinci: An Artist's Guide to Geometry, Anatomy and Proportion
Roig, Gabriel Martín
Paperback
$23.74
AI Snake Oil: What Artificial Intelligence Can Do, What It Can't, and How to Tell the Difference
Kapoor, Sayash
Narayanan, Arvind
Hardcover
$23.70
Texas DMV Driver's Handbook: Practice for the Texas Permit Test with 350+ Driving Questions and Answers
Prep, Discover
Paperback
$10.35
Reinventing Wool: How a Natural Fiber Survived the Synthetic Revolution
Littlefield, Melissa M.
Hardcover
$31.30
Essential Off-Grid Survival Projects: 50 Life-Saving Solutions for Shelter, Water, Food, and Safety
Furneaux, Ky
Hardcover
$24.69
The Powerful Primate: How Controlling Energy Enabled Us to Build Civilization
Ennos, Roland
Hardcover
$27.00
The Shortest History of Innovation: From the Wheel to Gene Editing, Ai, and Beyond - How New Ideas Shape Our World
Leigh, Andrew
Paperback
$16.10
Spec Ops: Case Studies in Special Operations Warfare: Theory and Practice
McRaven, William H.
Paperback
$21.85
The Unaccountability Machine: Why Big Systems Make Terrible Decisions--And How the World Lost Its Mind
Davies, Dan
Paperback
$19.00
Longitude: The True Story of a Lone Genius Who Solved the Greatest Scientific Problem of His Time
Sobel, Dava
Paperback
$17.09