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Tsv 3D RF Integration: High Resistivity Si Interposer Technology

Tsv 3D RF Integration: High Resistivity Si Interposer Technology

Paperback

Technology & Engineering

ISBN10: 0323996027
ISBN13: 9780323996020
Publisher: Elsevier
Published: Apr 27 2022
Pages: 292
Weight: 1.11
Height: 0.61 Width: 7.50 Depth: 9.25
Language: English

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.

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