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Testing of Interposer-Based 2.5d Integrated Circuits

Testing of Interposer-Based 2.5d Integrated Circuits

Hardcover

Technology & EngineeringGeneral Computers

ISBN10: 3319547135
ISBN13: 9783319547138
Publisher: Springer Nature
Published: Mar 29 2017
Pages: 182
Weight: 1.00
Height: 0.50 Width: 6.14 Depth: 9.21
Language: English

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

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