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Sip System-In-Package Design and Simulation: Mentor Ee Flow Advanced Design Guide

Sip System-In-Package Design and Simulation: Mentor Ee Flow Advanced Design Guide

Hardcover

Technology & Engineering

ISBN10: 1119045932
ISBN13: 9781119045939
Publisher: Wiley
Published: Jul 24 2017
Pages: 400
Weight: 2.00
Height: 1.20 Width: 6.90 Depth: 9.70
Language: English

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow

Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.

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Technology & Engineering