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Scaling and Integration of High-Speed Electronics and Optomechanical Systems

Scaling and Integration of High-Speed Electronics and Optomechanical Systems

Hardcover

Series: Selected Topics in Electronics and Systems, Book 59

Technology & Engineering

ISBN10: 9813225394
ISBN13: 9789813225398
Publisher: World Scientific Publishing Company
Published: Jun 1 2017
Pages: 152
Weight: 1.27
Height: 0.60 Width: 6.60 Depth: 9.80
Language: English
Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.

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