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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Optimal Interconnect Networks for 2D and 3D Microchips

Optimal Interconnect Networks for 2D and 3D Microchips

Sekar, Deepak

Paperback

Technology & Engineering

ISBN10: 3639073959
ISBN13: 9783639073959
Publisher: Blues Kids Of Amer
Published: Mar 25 2009
Pages: 144
Weight: 0.49
Height: 0.34 Width: 6.00 Depth: 9.00
Language: English
We are today in the era of gigascale 2D and 3D integrated circuits. These microchips are typically considered to be interconnect limited, with performance limited by signal, power, clock and thermal interconnect networks. Techniques to tackle this interconnect challenge are proposed and quantitatively evaluated in this book. Topics described by the author include integrated microchannel cooling of 3D stacked dice, repeater insertion models, carbon nanotube interconnects, parallel processing architectures, electromigration avoidance methods and a CAD tool to co-design signal, power, clock and thermal interconnect networks of microchips. This book should be especially useful to students and professionals in the areas of microelectronics, VLSI design, packaging and computer architecture.

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