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Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly

Hardcover

Technology & Engineering

ISBN10: 0470827807
ISBN13: 9780470827802
Publisher: Wiley
Published: May 17 2011
Pages: 576
Weight: 2.50
Height: 1.30 Width: 6.90 Depth: 9.80
Language: English

Also from

Liu, Shen

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Technology & Engineering