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Modeling and Application of Flexible Electronics Packaging

Modeling and Application of Flexible Electronics Packaging

Hardcover

Technology & Engineering

ISBN10: 9811336261
ISBN13: 9789811336263
Publisher: Springer Nature
Published: May 7 2019
Pages: 287
Weight: 1.34
Height: 0.75 Width: 6.14 Depth: 9.21
Language: English
Advanced Electronics Packaging.- Interfacial Modeling of Flexible Multilayer Structures.- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy.- Shear-Assisted Peeling.- Single-Needle Peeling.- Multi-Needle Peeling.- Conformal Peeling.- Laser Lift-Off.- Vacuum-Based Picking-up and Placing-on.

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Technology & Engineering