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Introduction to Microelectronics Advanced Packaging Assurance

Introduction to Microelectronics Advanced Packaging Assurance

Hardcover

Series: Synthesis Lectures on Engineering, Science, and Technology

Technology & EngineeringGeneral Computers

ISBN10: 3031861019
ISBN13: 9783031861017
Publisher: Springer
Published: Apr 23 2025
Pages: 183
Weight: 1.17
Height: 0.50 Width: 6.69 Depth: 9.61
Language: English

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

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