• Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Hardcover

Technology & EngineeringPhysics

Currently unavailable to order

ISBN10: 9819641659
ISBN13: 9789819641659
Publisher: Springer
Published: May 19 2025
Pages: 645
Weight: 2.75
Height: 1.80 Width: 6.60 Depth: 9.30
Language: English

Also from

Lau, John

Also in

Technology & Engineering