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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Encapsulation Materials for Neural Interface Devices

Encapsulation Materials for Neural Interface Devices

Hsu, Jui-Mei

Paperback

Technology & Engineering

ISBN10: 3639140753
ISBN13: 9783639140750
Publisher: Blues Kids Of Amer
Published: Apr 15 2009
Pages: 184
Weight: 0.61
Height: 0.42 Width: 6.00 Depth: 9.00
Language: English
Neural interface devices have been developed for neuroscience and neuroprosthetics applications to record and stimulate nerve signals. Chronic use of these devices is prevented by their lack of long- term stability, due to device failure or immune system responses. Conformal, hermetic, biocompatible, and electrically insulating coating materials that sustain chronic implantation and guarantee stable recording or stimulation are needed. Even though a large selection of materials has been proposed and tested for this purpose, to date, no material presented in scientific literature has been thoroughly characterized and qualified as a long- term hermetic encapsulation material for silicon- based neural interface devices. In this work, hydrogenated amorphous silicon carbide (a-SiCx: H) and Parylene-C films were investigated as the encapsulation materials. The deposition parameters and corresponding film properties were explored and correlated with the encapsulation characteristics.

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