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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interfa

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interfa

Paperback

Series: Springer Advanced Manufacturing

Technology & Engineering

Currently unavailable to order

ISBN10: 3030085619
ISBN13: 9783030085612
Publisher: Springer Nature
Published: Jan 5 2019
Pages: 115
Weight: 0.41
Height: 0.26 Width: 6.14 Depth: 9.21
Language: English

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Technology & Engineering