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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Hardcover

Technology & EngineeringGeneral Computers

ISBN10: 3319204807
ISBN13: 9783319204802
Publisher: Springer Nature
Published: May 23 2016
Pages: 339
Weight: 1.51
Height: 0.81 Width: 6.14 Depth: 9.21
Language: English
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

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