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Through Silicon Vias: Materials, Models, Design, and Performance

Through Silicon Vias: Materials, Models, Design, and Performance

Paperback

Technology & EngineeringGeneral ComputersPhysics

ISBN10: 0367574543
ISBN13: 9780367574543
Publisher: Crc Pr Inc
Published: Jun 30 2020
Pages: 216
Weight: 0.88
Height: 0.60 Width: 6.10 Depth: 9.10
Language: English

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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Physics