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Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

Hardcover

Technology & EngineeringPhysics

ISBN10: 3527352422
ISBN13: 9783527352425
Publisher: Wiley-Vch
Published: Dec 18 2023
Pages: 368
Weight: 1.91
Height: 0.76 Width: 6.86 Depth: 9.89
Language: English
Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.

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Physics