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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6: Proceedings of the 2019 Annual Conference on Experimental and Appl

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6: Proceedings of the 2019 Annual Conference on Experimental and Appl

Paperback

Series: Conference Proceedings of the Society for Experimental Mecha

Technology & EngineeringPhysics

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ISBN10: 3030301001
ISBN13: 9783030301002
Publisher: Springer
Published: Aug 26 2021
Pages: 169
Weight: 0.92
Height: 0.38 Width: 8.27 Depth: 10.98
Language: English

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:

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