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Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Packaging for 3D Assembly of Diverse Systems

Packaging for 3D Assembly of Diverse Systems

Paperback

Technology & EngineeringGeneral Computers

ISBN13: 9798230219835
Publisher: Independent Publisher
Published: Nov 25 2024
Pages: 108
Weight: 0.59
Height: 0.22 Width: 8.50 Depth: 11.00
Language: English

Another direction of improvement (of computing power) is to make physical machines three dimensional instead of all on a surface of a chip (2-D). That can be done in stages instead of all at once; you can have several layers and then many more layers as the time goes on. - an excerpt from talk delivered by Richard Feynman titled Computing Machines in the Future at the Gakushuin University in Tokyo on August 9,1985. Three decades later, advances in nanofabrication have enabled us to imagine, design, create and stack microchips for 3D Integration. Currently, heterogeneous 3D Integration is faster than Moore. This thesis details the development of processing technologies for the 3D packaging for integration of heterogeneous systems.

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General Computers