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612-822-4611
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan

Hardcover

Series: Ceramic Research and Development in Japan

Technology & EngineeringGeneral Computers

ISBN10: 185166579X
ISBN13: 9781851665792
Publisher: Springer Nature
Published: Apr 30 1993
Pages: 242
Weight: 1.19
Height: 0.63 Width: 6.14 Depth: 9.21
Language: English
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

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