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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces

Paperback

Series: Springer Theses

Technology & EngineeringPhysics

ISBN10: 3662517256
ISBN13: 9783662517253
Publisher: Springer Nature
Published: Aug 23 2016
Pages: 143
Weight: 0.51
Height: 0.34 Width: 6.14 Depth: 9.21
Language: English
Research Progress in Pb-free Soldering.- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface.- Tensile-compress Fatigue Behavior of Solder Joints.- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints.- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints.- Conclusions.

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Physics