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Copper Electrodeposition for Nanofabrication of Electronics Devices

Copper Electrodeposition for Nanofabrication of Electronics Devices

Hardcover

Series: Nanostructure Science and Technology, Book 171

Technology & EngineeringChemistryPhysics

ISBN10: 1461491754
ISBN13: 9781461491750
Publisher: Springer Nature
Published: Nov 21 2013
Pages: 282
Weight: 1.29
Height: 0.69 Width: 6.14 Depth: 9.21
Language: English
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: - ULSI wiring material based upon copper nanowiring - Printed circuit boards - Stacked semiconductors - Through Silicon Via - Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

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