• Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Chemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials

Hardcover

Series: Springer Materials Science, Book 69

Technology & EngineeringChemistry

ISBN10: 3540431810
ISBN13: 9783540431817
Publisher: Springer Nature
Published: Jan 26 2004
Pages: 428
Weight: 1.75
Height: 1.00 Width: 6.14 Depth: 9.21
Language: English

Chemical Mechanical Planarization (CMP) is fast becoming the established technology for removing unwanted materials after etching from the semiconductor chip surface, as well as for other steps in the manufacturing process. This volume is a comprehensive review of CMP technology in state-of-the-art semiconductor manufacturing. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered, as are polishing tools and consumables. The leading edge issues of damascene and new dielectrics as well as slurryless technology are also developed.

Also in

Chemistry