Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Advanced Thermal Stress Analysis of Smart Materials and Structures

Advanced Thermal Stress Analysis of Smart Materials and Structures

Chen, Zengtao
Akbarzadeh, Abdolhamid

Paperback

Series: Structural Integrity, Book 10

Technology & EngineeringGeneral MathematicsPhysics

ISBN10: 3030252035
ISBN13: 9783030252038
Publisher: Springer Nature
Published: Sep 19 2020
Pages: 304
Weight: 0.98
Height: 0.66 Width: 6.14 Depth: 9.21
Language: English

This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.

The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.

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