Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Three Dimensional System Integration: IC Stacking Process and Design

Three Dimensional System Integration: IC Stacking Process and Design

Papanikolaou, Antonis
Radojcic, Riko
Soudris, Dimitrios

Hardcover

Technology & EngineeringGeneral ArchitectureGeneral Computers

ISBN10: 1441909613
ISBN13: 9781441909619
Publisher: Springer
Published: Dec 15 2010
Pages: 246
Weight: 1.26
Height: 0.75 Width: 6.14 Depth: 9.21
Language: English
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

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